| 摘要: |
| 采用粉末烧结方法,利用光学显微镜、扫描电子显微镜、X射线衍射和能谱技术,研究了 Ni-Zn体系固相烧结 时粉末界面处形成的扩散溶解层的微观形貌和相结构，并利用TFDC电子理论讨论了扩散溶解层的形成机理。研究 表明,Ni粉和Zn粉在200 T ,15 h的烧结过程中,Zn原子不断扩散进人到Ni晶体中，在Ni粉颗粒基体上形成了由 NiZn和N^Zn^金属间化合物构成的“带状”扩散溶解层。 |
| 关键词: Ni-Zn 烧结；金属间化合物；TFDC电子理论；扩散连接 |
| DOI： |
| 分类号: |
| 基金项目:国家自然科学基金项目(50371059) |
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| Pilot studies on Ni/Zn diffusion dissolve layer |
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SONG Yu-qiang, LI Shi-chun
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(College of Mechanical and Electronic Engineering in China University of Petroleum，Dongying 257061，Shandong Province, Chiim)
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| Abstract: |
| The features of Ni/Zn diffusion dissolution layer formed at powder interface during solid sintering were observed using the technology of powder sintered, optics and electron microscope. The phase of layer was analyzed by energy dispersive spectrum ( EDS) and X-ray diffraction. The formation mechanism of diffusion dissolution layer was discussed by means of Thom-as-fermi-dirac-cheng model. The results show that Zn atoms can diffuse continuously into Ni particles, NiZn and N^Zn^ inter-metallic compounds were formed at the interface of Ni powder and Zn powder during sintering at 200 °C for 15 hours. |
| Key words: Ni-Zn sinteing intermetailic compounds Thomas-fermi-dirac-cheng model diffusion connection |
